Design of a Mold Insert Alignment System for Double-Sided Hot Embossing of Microfluidic Devices Using Kinematic Constraints

Abstract

The fabrication of microfluidic devices using hot embossing has increased in complexity. Many systems are multi component systems requiring that each be aligned properly with its mating components. Double-sided hot embossing is often used to produce stackable components for these assemblies. Accurate alignment of the two mold inserts, and therefore the opposing faces of the substrate, is a critical aspect to successful assembly of multi-layered modules.

A cost effective alignment system based on kinematic constraints was designed, fabricated, and tested to determine the accuracy and precision of the system. Double-sided substrates were hot embossed and characterized to evaluate the effectiveness of the design.