Design of a Mold Insert Alignment System for Double-Sided Hot Embossing of Microfluidic Devices Using Kinematic Constraints
Date
2013-11
Authors
Conner, Timothy Glenn
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Abstract
The fabrication of microfluidic devices using hot embossing has increased in complexity. Many systems are multi component systems requiring that each be aligned properly with its mating components. Double-sided hot embossing is often used to produce stackable components for these assemblies. Accurate alignment of the two mold inserts, and therefore the opposing faces of the substrate, is a critical aspect to successful assembly of multi-layered modules.
A cost effective alignment system based on kinematic constraints was designed, fabricated, and tested to determine the accuracy and precision of the system. Double-sided substrates were hot embossed and characterized to evaluate the effectiveness of the design.
Description
Keywords
Double-sided micro hot embossing, Alignment, Kinematic constraint, Microfluidics, Interconnection
Citation
Conner, T. G. (2013). Design of a mold insert alignment system for double-sided hot embossing of microfluidic devices using kinematic constraints</i> (Unpublished thesis). Texas State University-San Marcos, San Marcos, Texas.