Design of a Mold Insert Alignment System for Double-Sided Hot Embossing of Microfluidic Devices Using Kinematic Constraints
dc.contributor.advisor | You, Byoung Hee | |
dc.contributor.author | Conner, Timothy Glenn | |
dc.contributor.committeeMember | Song, In-Houk | |
dc.contributor.committeeMember | Sriraman, Vedaraman | |
dc.date.accessioned | 2013-11-27T18:09:05Z | |
dc.date.available | 2013-11-27T18:09:05Z | |
dc.date.issued | 2013-11 | |
dc.description.abstract | The fabrication of microfluidic devices using hot embossing has increased in complexity. Many systems are multi component systems requiring that each be aligned properly with its mating components. Double-sided hot embossing is often used to produce stackable components for these assemblies. Accurate alignment of the two mold inserts, and therefore the opposing faces of the substrate, is a critical aspect to successful assembly of multi-layered modules. A cost effective alignment system based on kinematic constraints was designed, fabricated, and tested to determine the accuracy and precision of the system. Double-sided substrates were hot embossed and characterized to evaluate the effectiveness of the design. | |
dc.description.department | Engineering Technology | |
dc.format | Text | |
dc.format.extent | 51 pages | |
dc.format.medium | 1 file (.pdf) | |
dc.identifier.citation | Conner, T. G. (2013). Design of a mold insert alignment system for double-sided hot embossing of microfluidic devices using kinematic constraints</i> (Unpublished thesis). Texas State University-San Marcos, San Marcos, Texas. | |
dc.identifier.uri | https://hdl.handle.net/10877/4892 | |
dc.language.iso | en | |
dc.subject | Double-sided micro hot embossing | |
dc.subject | Alignment | |
dc.subject | Kinematic constraint | |
dc.subject | Microfluidics | |
dc.subject | Interconnection | |
dc.subject.lcsh | Microfabrication | en_US |
dc.subject.lcsh | Microtechnology | en_US |
dc.subject.lcsh | Microfluidics | en_US |
dc.subject.lcsh | Machinery, Kinematics of | en_US |
dc.subject.lcsh | Multichip modules (Microelectronics) | en_US |
dc.title | Design of a Mold Insert Alignment System for Double-Sided Hot Embossing of Microfluidic Devices Using Kinematic Constraints | |
dc.type | Thesis | |
thesis.degree.department | Engineering Technology | |
thesis.degree.discipline | Industrial Technology | |
thesis.degree.grantor | Texas State University-San Marcos | |
thesis.degree.level | Masters | |
thesis.degree.name | Master of Science in Technology |
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