Analysis and determination of chemical mechanical planarization mechanisms for tungsten and copper

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dc.contributor.authorMitchell, Evelynn J. R.
dc.date.accessioned2022-02-18T14:39:15Z
dc.date.available2022-02-18T14:39:15Z
dc.date.issued2000-08
dc.description.abstractNo abstract prepared.
dc.description.departmentPhysics
dc.formatText
dc.format.extent64 pages
dc.format.medium1 file (.pdf)
dc.identifier.citationMitchell, E. J. R. (2000). Analysis and determination of chemical mechanical planarization mechanisms for tungsten and copper (Unpublished thesis). Southwest Texas State University, San Marcos, Texas.
dc.identifier.urihttps://hdl.handle.net/10877/15364
dc.language.isoen
dc.subjectsemiconductor wafers
dc.subjectsilicon surfaces
dc.subjectsurface preparation
dc.subjectcopper
dc.subjecttungsten
dc.titleAnalysis and determination of chemical mechanical planarization mechanisms for tungsten and copper
dc.typeThesis
thesis.degree.departmentPhysics
thesis.degree.grantorSouthwest Texas State University
thesis.degree.levelMasters
thesis.degree.nameMaster of Science

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