A Study of Micro-Mechanical Punching for the Interconnection of Polymer Microfluidic Devices

Simple item page
dc.contributor.advisorYou, Byoung Hee
dc.contributor.authorLek, Devanda Rex
dc.contributor.committeeMemberSriraman, Vedaraman
dc.contributor.committeeMemberKim, Yoo Jae
dc.contributor.committeeMemberSong, In-Hyouk
dc.contributor.committeeMemberKim, Namwon
dc.date.accessioned2019-02-13T17:12:36Z
dc.date.available2019-02-13T17:12:36Z
dc.date.issued2018-12
dc.description.abstract<p>The design of a microfluidic device can become encumbered when there is a desire to include multiple functional features. To avoid these complications one alternative is the modular design where independent devices are assembled into a system. To achieve this design structures that interconnect the modules are needed such as a micro- through-hole. Through-holes have been conventionally fabricated at the macroscale with mechanical punching. There has been a significant focus on the micro- mechanically punching of metallic foils and attention to polymeric foils is limited.</p> <p>In this study the generation of micro-through-holes was investigated with experiments and numerical modeling. The micro- mechanical punching process was integrated with double-sided hot embossing. A pair of mold inserts were designed with features for the fabrication of through-hole, and features for a passive alignment step. Features for mechanical punching were designed to provide five levels of punch to die clearances, and a set of pins with an aspect ratio of 1:1. The mold inserts were applied to fabricate through-holes on a sheet of thermoplastic polymer. The resulting through-holes were characterized to observe the effect of the selected clearances.</p> <p>The results of the experiments and the simulations showed that clearance has a significant effect on the micro-punching process. As clearance was increased it allowed more substrate material to flow into the die. When more material flowed into the die it would affect the ability to generate a fracture and its propagation through the substrate. This would have a significant influence on the success of generating a through-hole and its subsequent dimensions and the topography of the sidewalls.</p>
dc.description.departmentMaterials Science, Engineering, and Commercialization
dc.formatText
dc.format.extent140 pages
dc.format.medium1 file (.pdf)
dc.identifier.citationLek, D. R. (2018). <i>A study of micro-mechanical punching for the interconnection of polymer microfluidic devices</i> (Unpublished dissertation). Texas State University, San Marcos, Texas.
dc.identifier.urihttps://hdl.handle.net/10877/7871
dc.language.isoen
dc.subjectMechanical punching
dc.subjectInterconnection
dc.subjectThrough-hole
dc.subjectHot embossing
dc.subjectMicrofluidics
dc.subject.lcshFluidic devices--Design and constructionen_US
dc.subject.lcshMicrofluidicsen_US
dc.subject.lcshPolymers--Surfacesen_US
dc.titleA Study of Micro-Mechanical Punching for the Interconnection of Polymer Microfluidic Devices
dc.typeDissertation
thesis.degree.departmentMaterials Science, Engineering, and Commercialization Program
thesis.degree.disciplineMaterials Science, Engineering, and Commercialization
thesis.degree.grantorTexas State University
thesis.degree.levelDoctoral
thesis.degree.nameDoctor of Philosophy

Files

Original bundle

Now showing 1 - 1 of 1
Thumbnail Image
Name:
LEK-DISSERTATION-2018.pdf
Size:
5.3 MB
Format:
Adobe Portable Document Format
Download

License bundle

Now showing 1 - 2 of 2
No Thumbnail Available
Name:
PROQUEST_LICENSE.txt
Size:
4.52 KB
Format:
Plain Text
Description:
Download
No Thumbnail Available
Name:
LICENSE.txt
Size:
2.12 KB
Format:
Plain Text
Description:
Download

Collections

Graduate Theses and Dissertations