Analysis and determination of chemical mechanical planarization mechanisms for tungsten and copper
Date
2000-08
Authors
Mitchell, Evelynn J. R.
Journal Title
Journal ISSN
Volume Title
Publisher
Abstract
No abstract prepared.
Description
Keywords
semiconductor wafers, silicon surfaces, surface preparation, copper, tungsten
Citation
Mitchell, E. J. R. (2000). Analysis and determination of chemical mechanical planarization mechanisms for tungsten and copper (Unpublished thesis). Southwest Texas State University, San Marcos, Texas.