Modeling Chemical Mechanical Planarization of Copper with an Atomic Force Microscope

Simple item page
dc.contributor.authorFishbeck, Kelly
dc.date.accessioned2020-05-11T15:35:40Z
dc.date.available2020-05-11T15:35:40Z
dc.date.issued2002-08
dc.description.abstractNo abstract prepared.
dc.description.departmentPhysics
dc.formatText
dc.format.extent80 pages
dc.format.medium1 file (.pdf)
dc.identifier.citationFishbeck, K. (2002). Modeling chemical mechanical planarization of copper with an atomic force microscope (Unpublished thesis). Southwest Texas State University, San Marcos, Texas.
dc.identifier.urihttps://hdl.handle.net/10877/9833
dc.language.isoen
dc.subjectcopper
dc.subjectintegrated circuits
dc.subjectatomic force microscopy
dc.titleModeling Chemical Mechanical Planarization of Copper with an Atomic Force Microscope
dc.typeThesis
thesis.degree.departmentPhysics
thesis.degree.grantorSouthwest Texas State University
thesis.degree.levelMasters
thesis.degree.nameMaster of Science

Files

Original bundle

Now showing 1 - 1 of 1
Thumbnail Image
Name:
Fishbeck_Kelly_2002.pdf
Size:
5.07 MB
Format:
Adobe Portable Document Format
Download

Collections

Graduate Theses and Dissertations